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<div>EdgeSys'22 is open for submissions now:</div>
<div><a href="https://edgesys22.hotcrp.com/" class="OWAAutoLink">https://edgesys22.hotcrp.com/</a>  </div>
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<div>The EdgeSys series have been gathering substantial community contributions, especially with high quality TPC, keynotes, panel and technical papers from US, Europe and Asia, including Google, Amazon, Microsoft, Apple, Facebook, Alibaba, Intel, IBM, Nokia,
 Ericsson, Samsung, Toyota, Telef�nica, MPI, Helmholtz, MIT, Berkeley, Columbia, Yale, UCLA, CMU, Cambridge, Imperial, EPFL, TU Delft, TUM, Tsinghua, Peking and Fudan.</div>
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<div>Programme Committee and submission guideline:</div>
<div><a href="https://edge-sys.github.io/2022/committee.html" class="OWAAutoLink">https://edge-sys.github.io/2022/committee.html</a>  </div>
<div><a href="https://edge-sys.github.io/2022/submission.html" class="OWAAutoLink">https://edge-sys.github.io/2022/submission.html</a>  </div>
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<div>Look forward to submissions from RIPE!</div>
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<div>Aaron</div>
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